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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 1/7
H34063AP / H34063AS
DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES
Description
The H34063A Series is a monolithic control circuit containing the primary functions required for DC-to-DC converters. These devices consist of an internal temperature compensated reference, comparator, controlled duty cycle oscillator with an active current limit circuit, driver and high current output switch. This series was specifically by Hi-Sincerity Microelectronics Corp.
8-Lead Plastic DIP-8 Package Code: P *
8-Lead Plastic SO-8 Package Code: S
Features
* 3V to 40V Input Voltage Operation * Internal 1.6A Peak Current Switch * Internal 1.8% Reference * Low Quiescent Current at 1.6mA * Frequency Operation from 100Hz~100KHz * Output Voltage Adjustable * Active Current Limiting * Step-Up, Step-Down or Inverting Switching Regulators
Pin Connections
8 7 6 5
Pin1: Switch Collector (SWC) Pin2: Switch Emitter (SWE) Pin3: Timing Capacitor (TC) Pin4: Ground (GND)
Pin5: Comparator Inverting Input (FB) Pin6: Voltage Supply (Vcc) Pin7: Ipk Sense (Ipk) Pin8: Voltage Driver Collector (DRC)
1
2
3
4
Absolute Maxium Rating
Parameter Power Supply Voltage Comparator Input Voltage Range Switch Collector Voltage Switch Emitter Voltage Switch Emitter to Collector Voltage Driver Collector Voltage Switch Current Power Dissipation at TJ=20oC Operating Ambient Temperature Range Storage Temperature Range Operating Junction Temperature Thermal Resistance Junction-ambient Symbol VCC Vir VC(SW) VSWE VCE VC(DR) ISW PD Topr Tstg Topj JA DIP-8 SO-8 0~+70 -65~+150 120 125
o
Value 40 -0.3~+40 40 40 40 40 1.5 1.25 0.625
Unit V V V V V V A W
o o o
C C C
C/W
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics (VCC=5V,TA=0~70C, unless otherwise specified)
Parameter Oscillator Charging Current Discharge Current Frequency Discharge to Charge Current Ratio Current Limit Sense Voltage Output Switch Saturation Voltage, Darlington Connection Saturation Voltage DC Current Gain Collector Off-State Current Comparator Threshold Voltage Threshold Voltage Line Regulation Input Bias Current Total Device Supply Current ICC VCC=5~40V, VPIN7=VCC, VPin5>VFB, CT=0.001uF, Pin7=GND, Remaining pins open VFB VFB IIB VCC=5~40V VIN=0V 1.23 VCE(sat) 1 VCE(sat) 2 hFE ICC(off) ISW =1A, VC(SW)=VC(DR) ISW =1A, IC(DR)=50mA ISW =1A, VCE=5V VCE=40V, Ta=25 C
o
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 2/7
Symbol Ichg Idischg fOSC Idischg/Ichg VIPK
Test Condition VCC=5~40V, Ta=25oC VCC=5~40V, Ta=25 C VPIN5=0, CT=1nF, Ta=25 C VPIN7=VCC, Ta=25 C Idischg=Ichg, Ta=25 C
o o o o
Min. 10 140 28 5.2 250
Typ. 25 190 33 6 300
Max. 40 240 40 7.5 350
Unit uA uA KHz mV
35 -
1 0.4 120 10 1.25 1.5 40
1.3 0.7 100 1.27 6 400
V V uA V mV nA
1.6
3
mA
Block Diagram
SC
Pin1: 1.6A Switch Collector Q2 Q1 80 Q S R
DRI
Pin8: Driver Collector
IPK
CT Oscillator IPK Pin7: Highside Current Sense Input, VCC-VIPK=300mV
SE
Pin2: Darlington Switch Emitter
TC
Pin3: Oscilletor Timing Capacitor 1.25V Reference Voltage
VCC
Comparator Pin6: Power Supply Input
+ FB
Pin5: Feedback Comparator Inverting Input
GND
Pin4: Power GND
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Application Information
Design Formula Table Calculation ton/toff (ton+toff) max CT IC(sw) RS L(min) CO Step-Down (Vout+VF)/(Vin(min) -Vsat-Vout) 1/Fmin 4*10 ton 2*Iout(max) 0.3/IC(sw) (Vin(min)-Vsat/Ipk(sw))*ton(max) (Ipk(sw)*(ton+toff))/(8*Vripple(P-P))
-5
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 3/7
Step-Up (Vout+VF-Vin(min))/(Vin(min)-Vsat) 1/Fmin 4*10 ton 2*Iout(max)(ton+toff/toff) 0.3/IC(sw) (Vin(min)-Vsat/Ipk(sw))*ton(max) Iout*ton/Vripple(P-P)
-5
Voltage-Inverting (|Vout|+VF)/(Vin(max)-Vsat) 1/Fmin 4*10-5ton 2*Iout(max)(ton+toff/toff) 0.3/IC(sw) (Vin(min)-Vsat/Ipk(sw))*ton(max) Iout*ton/Vripple(P-P)
Vsat: Saturation voltage of the output switch. VF: Forward voltage drop of the ringback rectifier. The following power supply characteristics must be chosen: Vin: Nominal input voltage. Vout: Desired output voltage. |Vout|=1.25*(1+RB/RA) Iout: Desired output current Fmin: Minimum desired output switching frequency at the selected values for Vin and Iout. Vripple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly effect the line and load regulation.
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Application Information (Continuos)
Fig.2 Step-Up Converter
L1 R1
150 200uH
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 4/7
D1
H1N5819
Vout 28V / 200mA Cout
H34063A
8 7 6 1 2 3 4
RSC
0.22
220uF
Vin C1
100uF
5
CT
680pF
RB RA
2.2k 47k
Line Regulation: 100mV (Vin=8V~16V, @Io=200mA) Load Regulation: 5mV (Vin=12V, @Io=80mA~200mA) Fig.3 Step-Up Converter With External NPN Switch
L1 R1 D1 Vout
H34063A
8 1 2 3 4
RSC Vin C1
7 6 5
Q1 CT R2
Cout
RB RA
Fig.4 Step-Down Converter
L1 H34063A RSC
0.25 200uH
Vout 5V / 500mA Cout
8 7 6 5
1 2 3 4
D1
H1N5819
470uF
Vin
CT
470pF
C1
100uF
RB RA
1.2k 3.6k
Line Regulation: 40mV (Vin=10V~20V, @Io=500mA) Load Regulation: 5mV (Vin=15V, @Io=10mA~500mA) Short Circuit Current: 1.3A (Vin=15V, @RL=0.1
H34063AP, H34063AS HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 5/7
Fig.5 Step-Down Converter With External PNP Saturation Switch
H34063A
8 1 2 3 4
R1 R2 Q1 L1 Vout CT D1 Cout
RSC Vin
7 6 5
C1 RA
RB
Fig.6 Voltage Inverting Converter
D1 Vout -12V / 100mA
H34063A RSC
0.25 8 7 6 5 1 2 3 4
H1N5819
L1
100uH
Cout
470uF
Vin 4.5V-6V
CT
680pF
C1
100uF
RA RB
8.2k 953
Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA) Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA) Fig.7 Voltage Inverting Converter With External PNP Saturation Switch
H34063A
8 1 2 3 4
R2 R1 Q1
RSC Vin
7 6 5
L1 CT
D1
RA C1 RB Cout
Vout
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
DIP-8 Dimension
Marking:
8 7 6 5
Pb Free Mark
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 6/7
A
1 2 3 4
Pb-Free: " . " (Note) Normal: None
H 34063A
P
Date Code
Control Code
B
J F
Note: Green label is used for pb-free packing Pin Style: 1.SWC 2.SWE 3.TC 4.GND 5.FB 6.VCC 7.Ipk 8.DRC Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
C
E D
G H
1 K
M L
DIM A B C D E F G H I J K L M 1
Min. 6.29 9.22 3.25 3.17 0.38 2.28 7.49 8.56 0.229 94o
Max. 6.40 9.32 *1.52 *1.27 *0.99 3.35 3.55 0.53 2.79 7.74 *3.00 8.81 0.381 97o
*: Typical, Unit: mm
I
8-Lead DIP-8 Plastic Package HSMC Package Code: P
SO-8 Dimension
A G
Marking:
Pb Free Mark
Pb-Free: " . " (Note) H Normal: None
8 B
7
6
5 C 4 J H
I
S
34063A Control Code
Pin 1 Index Date Code
Pin1 Index
2
3
Note: Green label is used for pb-free packing Pin Style: 1.SWC 2.SWE 3.TC 4.GND 5.FB 6.VCC 7.Ipk 8.DRC
D
E
Part A
K L N O
Part A
Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
M
DIM A B C D E F G H I J K L M N O
Min. 4.85 3.85 5.80 1.22 0.37 3.74 1.45 4.80 0.05 0.30 0.19 0.37 0.23 0.08 0.00
Max. 5.10 3.95 6.20 1.32 0.47 3.88 1.65 5.10 0.20 0.70 0.25 0.52 0.28 0.13 0.15
*: Typical, Unit: mm
F
8-Lead SO-8 Plastic Surface Mounted Package HSMC Package Code: S
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
H34063AP, H34063AS
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC's Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile
tP TP Ramp-up TL Tsmax Temperature tL
Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 7/7
Critical Zone TL to TP
Tsmin tS Preheat
Ramp-down
25 t 25oC to Peak Time
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices.
Sn-Pb Eutectic Assembly <3 C/sec 100oC 150oC 60~120 sec <3oC/sec 183oC 60~150 sec 240oC +0/-5oC 10~30 sec <6oC/sec <6 minutes
o
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 sec <3oC/sec 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes
Peak temperature 245 C 5 C
o o
Dipping time 5sec 1sec 5sec 1sec
260 C +0/-5 C
o
o
H34063AP, H34063AS
HSMC Product Specification


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